Surface Mount Technology
Overview of SMT Assembly
Surface Mount Technology (SMT) is a method for producing electronic circuits where the components are mounted directly onto the surface of PCBs (Printed Circuit Boards), rather than being inserted into holes. SMT is a highly automated process, crucial for the production of modern electronics.
Key Components of SMT Assembly
- Solder Paste Printing
Solder paste is applied to the PCB pads using a stencil. It’s crucial to apply an accurate amount of paste to ensure proper component attachment during soldering. - Pick and Place Machine
This machine places surface-mount components onto the solder-pasted PCB. It uses precise motion systems to pick components from reels or trays and places them accurately on the board. - Reflow Soldering
After placement, the PCB moves through a reflow oven, where the solder paste is heated to a molten state and forms solder joints between the components and PCB pads. - Inspection and Quality Control
Post-assembly, visual or automated optical inspection (AOI) is used to check for defects like soldering issues, component misplacement, or missing parts. - Testing
After assembly, various electrical and functional tests are performed to ensure the board functions as intended. This can include in-circuit testing (ICT) or functional testing.
At Micro PCB, we are equipped to accommodate the finest pitch component placements with our Surface Mount Technology machines. We welcome a variety of printed circuit boards for a variety of sectors such as consumer electronics, military devices, and medical devices. In addition, we are able to cater for small to large productions and can accommodate prototyping requirements.
