Surface Mount Technology

Overview of SMT Assembly

Surface Mount Technology (SMT) is a method for producing electronic circuits where the components are mounted directly onto the surface of PCBs (Printed Circuit Boards), rather than being inserted into holes. SMT is a highly automated process, crucial for the production of modern electronics.

Key Components of SMT Assembly

  1. Solder Paste Printing
    Solder paste is applied to the PCB pads using a stencil. It’s crucial to apply an accurate amount of paste to ensure proper component attachment during soldering.
  2. Pick and Place Machine
    This machine places surface-mount components onto the solder-pasted PCB. It uses precise motion systems to pick components from reels or trays and places them accurately on the board.
  3. Reflow Soldering
    After placement, the PCB moves through a reflow oven, where the solder paste is heated to a molten state and forms solder joints between the components and PCB pads.
  4. Inspection and Quality Control
    Post-assembly, visual or automated optical inspection (AOI) is used to check for defects like soldering issues, component misplacement, or missing parts.
  5. Testing
    After assembly, various electrical and functional tests are performed to ensure the board functions as intended. This can include in-circuit testing (ICT) or functional testing.

At Micro PCB, we are equipped to accommodate the finest pitch component placements with our Surface Mount Technology machines. We welcome a variety of printed circuit boards for a variety of sectors such as consumer electronics, military devices, and medical devices. In addition, we are able to cater for small to large productions and can accommodate prototyping requirements.